Skripsi

ANALISIS SIFAT DIELEKTRIK PADA MATERIAL ISOLASI EPOXY RESIN BERPENGISI SILICONE DIOXIDE (SiO₂)

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This paper aims to analyze the effect of adding silicone dioxide (SiO₂) as a filler on the dielectric properties of epoxy resin. The samples were prepared using Bisphenol A–Epichlorohydrin epoxy resin with SiO₂ filler concentrations of 1; 2; 3; 4; 5 wt%. The tests were conducted using a plate-plate electrode system at a frequency of 50 Hz to measure the relative permittivity, dissipation factor (tan δ), and dielectric strength. The results indicates that the addition of SiO₂ increased the relative permittivity value up to 31.1% compared to pure epoxy resin. The dissipation factor also increased with higher SiO₂ content due to space charge accumulation at the particle interface. The dielectric strength reached its maximum value of 13.1 kV/mm at a concentration of 2 wt%, then decreased at higher concentrations due to particle agglomeration. Therefore, the optimal composition was found at 2 wt% SiO₂, where the material indicated the best balance between relative permittivity, dissipation factor, and dielectric strength. These results indicate that SiO₂ effectively enhances the dielectric performance of epoxy resin for high-voltage insulation applications.

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Detail Information

Series Title

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Call Number

T1869892025

Publisher

Indralaya : Prodi Teknik Elektro, Fakultas Teknik Universitas Sriwijaya., 2025

Collation

xx, 106 hlm.; ilus.; tab.; 29 cm.

Language

Indonesia

ISBN/ISSN

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Classification

621.319 370 7

Content Type

Text

Media Type

unmediated

Carrier Type

other (computer)

Edition

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Subject(s)

Prodi Teknik Elektro
Material Isolasi Listrik

Specific Detail Info

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Statement of Responsibility

MI

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