APA Style
Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason. ().
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility .
:
Wiley-IEEE Press.
Chicago Style
Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason.
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility.
:
Wiley-IEEE Press,
.
electronic.
MLA Style
Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason.
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility.
:
Wiley-IEEE Press,
.
electronic.
Turabian Style
Hwang, Lih-Tyng, Horng, Tzyy-Sheng Jason.
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility.
:
Wiley-IEEE Press,
.
electronic.