SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

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SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Hwang, Jennie S. - Personal Name;

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Central Library (CIRCULATION BKT) 621.381 Hwa s 1992

B13321S

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Detail Information

Series Title: -
Call Number: 621.381 Hwa s
Publisher: New York : Van Nostrand Reinhold., 1992
Collation: 456 p. : ill. ; 23 cm
Language: English
ISBN/ISSN: 0-442-20754-9
Classification: 621.381
Content Type: Text
Media Type: unmediated
Carrier Type: -
Edition: -
Subject(s): Printed Circuits-Design and Construction
Surface Mount Technology
Solder Pastes
Specific Detail Info: -
Statement of Responsibility: DS

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