Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this bo…
Closes the gap between those who are online already and who are not. Provides with the status-quo and a glimpse at future developments. Provides an overview of web 2.0 tools for scientists with concrete how-to’s. Introduces the concept of open science
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