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Found 1 from your keywords: author=Huang,YongAn

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Modeling and Application of Flexible Electronics Packaging

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This b…

Edition: 1
ISBN/ISSN: 978-981-13-3627-0
Collation: XVII, 287p.:Ill
Series Title: -
Call Number: 621.381 Hua m

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